Volume 2,Issue 3
中国 Chiplet 技术发展路线图与产业政策建议
本文深入剖析中国 Chiplet 技术的发展路线图，全面梳理其在技术演进、市场应用及产业生态建设方面的现状与趋势，并结合国际竞争格局，提出针对性产业政策建议。旨在为中国 Chiplet 技术突破发展瓶颈、提升产业竞争力、实现可持续发展提供理论支持与决策参考。
[1]肖勇勇.中国集成电路产业全要素生产率及影响因素的研究[D].广西大学,2021.DOI:10.27034/d.cnki.ggxiu.2021.000327.
[2]吉勇,王成迁,李杨.扇出型封装发展、挑战和机遇[J].电子与封装,2020,20(08):3-8.
[3]Mutschler A. ‘More than Moore’ reality check [EB/OL]. Semiconductor Engineering. [2020-05-14]. Available from: http://www.semiengineering.com/more-than
moore-reality-check.
[4]李应选.Chiplet的现状和需要解决的问题[J].微电子学与计算机,2022,39(05):1-9.
[5]Coudrain P,Charbonnier J,Garnier A,et al.Active inter‐ poser technology for chiplet-based advanced 3D system architectures[C]//2019 IEEE 69th Electronic Components
and Technology Conference(ECTC).Piscataway:IEEE Press,2019,doi:10.1109/ECTC.2019.00092.
[6]杨晖.后摩尔时代Chiplet技术的演进与挑战[J].集成电路应用,2020,37(05):52-54.
[7]王若达.先进封装推动半导体产业新发展[J].中国集成电路,2022,31(04):26-29+42.
[8]杨忠,巫强,宋孟璐,孙佳怡.美国《芯片与科学法案》对我国半导体产业发展的影响及对策研究：基于创新链理论的视角[J].南开管理评论,2023,26(01):146-160.
[9]"Chinese chip industry has to readjust to deglobalization," Digitimes, 2023. [Online]. Available: https://www.digitimes.com/news/a20230629VL200.html. [Accessed: 30
June-2023].
[10]"Will the US succeed in starving China of semiconductors?," DW, 2023. [Online]. Available: https://www.dw.com/en/us-china-semiconductor/a-59251512. [Accessed:
30-June-2023].