ARTICLE
Volume 3,Issue 9
20 December 2025
晶圆留边减薄后的清洗工艺研究
阳 白1 ,
远航 李1 ,
丹 李1
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1
中国电子科技集团公司第四十五研究所,
中国
ETQM 2025 , 3(12), 42–44;
https://doi.org/10.61369/ETQM.2025120020
© 2025 by the Author(s). Licensee Art and Design, USA. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution -Noncommercial 4.0 International License (CC BY-NC 4.0) ( https://creativecommons.org/licenses/by-nc/4.0/ )
Abstract
介绍了晶圆留边减薄后清洗的工艺过程和原理，主要研究了晶圆留边工艺减薄后清洗过程中清洗方法、清洗时间对清洗效果的影响。提出改善清洗效果的工艺措施，为提高晶圆留边工艺加工过程中的清洗效率提供指导。
Keywords
晶圆留边工艺减薄
清洗
工艺研究
References
[1] 李彧. 晶圆留边磨削减薄工艺基础研究[J].大连理工大学.2021,02:70.
[2] 孙莉莉. 碳化硅减薄后的清洗工艺研究[J].电子工业专用设备.2025,54(01):33-36.
[3] 张雨生, 何箐, 由晓明, 梁立康, 张云杰. 二流体雾化器雾化过程仿真及试验[J]. 农业工程.2023,13(08):107-112.
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